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 IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
32Meg x 8, 16Meg x16 256-MBIT SYNCHRONOUS DRAM
FEATURES
* Clockfrequency:166,143MHz * Fullysynchronous;allsignalsreferencedtoa positive clock edge * Internalbankforhidingrowaccess/precharge * SinglePowersupply:3.3V+0.3V * LVTTLinterface * Programmableburstlength -(1,2,4,8,fullpage) * Programmableburstsequence: Sequential/Interleave * AutoRefresh(CBR) * SelfRefresh * 8Krefreshcyclesevery16ms(A2grade)or 64ms(commercial,industrial,A1grade) * Randomcolumnaddresseveryclockcycle * ProgrammableCASlatency(2,3clocks) * Burstread/writeandburstread/singlewrite operations capability * Burstterminationbyburststopandprecharge command
IS42S83200D 54-pinTSOPII IS42S16160D 54-pinTSOPII 54-ballBGA(contactMarketing) 8Mx8x4Banks 4Mx16x4Banks
JUNE 2009
OVERVIEW ISSI's256MbSynchronousDRAMachieveshigh-speed
data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The256MbSDRAMisorganizedasfollows.
KEY TIMING PARAMETERS
Parameter ClkCycleTime CASLatency=3 CASLatency=2 ClkFrequency CASLatency=3 CASLatency=2 AccessTimefromClock CASLatency=3 CASLatency=2 -6 6 10 166 100 5.4 6.5 -7 7 10 143 100 5.4 6.5 -75E -- 7.5 -- 133 -- 5.5 Unit ns ns Mhz Mhz ns ns
OPTIONS
* Package: 54-pinTSOP-II(x8andx16) 54-ballBGA(x16only) * OperatingTemperatureRange: Commercial (0oC to +70oC) Industrial(-40oCto+85oC) AutomotiveGradeA1(-40oCto+85oC) AutomotiveGradeA2(-40oC to +105oC) * DieRevision:D
ADDRESS TABLE
Parameter Configuration Refresh Count 32M x 8 8M x 8 x 4 banks Com./Ind. 8K/64ms A1 8K/64ms A2 8K/16ms A0-A12 A0-A9 BA0, BA1 A10/AP 16M x 16 4M x 16 x 4 banks 8K/64ms 8K/64ms 8K/16ms A0-A12 A0-A8 BA0, BA1 A10/AP
Row Addresses Column Addresses Bank Address Pins Auto Precharge Pins
Copyright (c) 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
1
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
DEVICE OVERVIEW
The 256Mb SDRAM is a high speed CMOS, dynamic random-accessmemorydesignedtooperatein3.3VVdd and3.3VVddq memorysystemscontaining268,435,456 bits.Internallyconfiguredasaquad-bankDRAMwitha synchronousinterface.Each67,108,864-bitbankisorganizedas8,192rowsby512columnsby16bitsor8,192 rowsby1,024columnsby8bits. The256MbSDRAMincludesanAUTOREFRESHMODE, and a power-saving, power-down mode. All signals are registeredonthepositiveedgeoftheclocksignal,CLK. AllinputsandoutputsareLVTTLcompatible. The256MbSDRAMhastheabilitytosynchronouslyburst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time and the capability to randomly change column addresses on each clock cycle during burst access. A self-timed row precharge initiated at the end of the burst sequenceisavailablewiththeAUTOPRECHARGEfunction enabled. Precharge one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed, random-access operation. SDRAM read and write accesses are burst oriented starting at a selected location and continuing for a programmed number of locations in a programmed sequence. The registration of an ACTIVE command begins accesses, followedbyaREADorWRITEcommand.TheACTIVE command in conjunction with address bits registered are used to select the bank and row to be accessed (BA0, BA1selectthebank;A0-A12selecttherow).TheREAD or WRITE commands in conjunction with address bits registered are used to select the starting column location for the burst access. ProgrammableREADorWRITEburstlengthsconsistof 1,2,4and8locationsorfullpage,withaburstterminate option.
FUNCTIONAL BLOCK DIAGRAM (FOR 4Mx16x4 BANKS SHOWN)
CLK CKE CS RAS CAS WE
DQML DQMH
16 2
COMMAND DECODER & CLOCK GENERATOR
DATAIN BUFFER
16
MODE REGISTER
13
REFRESH CONTROLLER
DQ0-15
SELF REFRESH CONTROLLER
A10 A12
A11 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 BA0 BA1
16
DATAOUT BUFFER
VDD/VDDQ Vss/VssQ
16
REFRESH COUNTER
8192 8192 8192 8192
ROWDECODER
MULTIPLEXER
13
MEMORYCELL ARRAY
13
ROW ADDRESS LATCH
13
ROW ADDRESS BUFFER
BANK 0
SENSEAMPI/OGATE
COLUMN ADDRESSLATCH
9
512 (x16)
BANKCONTROLLOGIC
BURSTCOUNTER COLUMN ADDRESSBUFFER
COLUMNDECODER
9
2
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
PIN CONFIGURATIONS
54 pin TSOP - Type II for x8
VDD DQ0 VDDQ NC DQ1 VSSQ NC DQ2 VDDQ NC DQ3 VSSQ NC VDD NC WE CAS RAS CS BA0 BA1 A10 A0 A1 A2 A3 VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
VSS DQ7 VSSQ NC DQ6 VDDQ NC DQ5 VSSQ NC DQ4 VDDQ NC VSS NC DQM CLK CKE A12 A11 A9 A8 A7 A6 A5 A4 VSS
PIN DESCRIPTIONS
A0-A12 A0-A9 BA0,BA1 DQ0toDQ7 CLK CKE CS RAS CAS RowAddressInput Column Address Input BankSelectAddress DataI/O SystemClockInput ClockEnable Chip Select RowAddressStrobeCommand Column Address Strobe Command WE DQM Vdd Vss Vddq Vssq NC WriteEnable DataInput/OutputMask Power Ground PowerSupplyforI/OPin GroundforI/OPin NoConnection
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
3
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
PIN CONFIGURATIONS
54 pin TSOP - Type II for x16
VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 VDD DQML WE CAS RAS CS BA0 BA1 A10 A0 A1 A2 A3 VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27
54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 VSS NC DQMH CLK CKE A12 A11 A9 A8 A7 A6 A5 A4 VSS
PIN DESCRIPTIONS
A0-A12 A0-A8 BA0,BA1 DQ0toDQ15 CLK CKE CS RAS CAS RowAddressInput ColumnAddressInput BankSelectAddress DataI/O SystemClockInput ClockEnable Chip Select RowAddressStrobeCommand Column Address Strobe Command WE DQML DQMH Vdd Vss Vddq Vssq NC WriteEnable x16LowerByte,Input/OutputMask x16UpperByte,Input/OutputMask Power Ground PowerSupplyforI/OPin GroundforI/OPin NoConnection
4
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
PIN CONFIGURATION 54-ball fBGA for x16 (TopView)(8.00mmx13.00mmBody,0.8mmBallPitch) packagecode:B
1
2 3 4 5 6 7 8 9
A B C D E F G H J
VSS DQ15 VSSQ DQ14 DQ13 VDDQ DQ12 DQ11 VSSQ DQ10 DQ9 VDDQ DQ8 NC VSS CKE A9 A6 A4
VDDQ DQ0 VDD VSSQ DQ2 DQ1 VDDQ DQ4 DQ3 VSSQ DQ6 DQ5 VDD DQML DQ7 CAS BA0 A0 A3 RAS BA1 A1 A2 WE CS A10 VDD
DQMH CLK A12 A8 VSS A11 A7 A5
PIN DESCRIPTIONS
A0-A12 A0-A8 BA0,BA1 DQ0toDQ15 CLK CKE CS RAS CAS RowAddressInput ColumnAddressInput BankSelectAddress DataI/O SystemClockInput ClockEnable Chip Select RowAddressStrobeCommand Column Address Strobe Command WE DQML DQMH Vdd Vss Vddq Vssq NC WriteEnable x16LowerByteInput/OutputMask x16UpperByteInput/OutputMask Power Ground PowerSupplyforI/OPin GroundforI/OPin NoConnection
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
5
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
PIN FUNCTIONS
Symbol A0-A12 Type InputPin Function (In Detail) AddressInputs:A0-A12aresampledduringtheACTIVEcommand(row-address A0-A12)andREAD/WRITEcommand(columnaddressA0-A9(x8),orA0-A8(x16); withA10definingautoprecharge)toselectonelocationoutofthememoryarrayin therespectivebank.A10issampledduringaPRECHARGEcommandtodetermine ifallbanksaretobeprecharged(A10HIGH)orbankselectedbyBA0,BA1(LOW). Theaddressinputsalsoprovidetheop-codeduringaLOADMODEREGISTER command. BankSelectAddress:BA0andBA1defineswhichbanktheACTIVE,READ,WRITE orPRECHARGEcommandisbeingapplied. CAS, in conjunction with the RAS and WE, forms the device command. See the "CommandTruthTable"fordetailsondevicecommands. TheCKEinputdetermineswhethertheCLKinputisenabled.Thenextrisingedge oftheCLKsignalwillbevalidwhenisCKEHIGHandinvalidwhenLOW.WhenCKE isLOW,thedevicewillbeineitherpower-downmode,clocksuspendmode,orself refresh mode. CKEisan asynchronous input. CLKisthemasterclockinputforthisdevice.ExceptforCKE,allinputstothisdevice areacquiredinsynchronizationwiththerisingedgeofthispin. TheCS input determines whether command input is enabled within the device. Command input is enabled when CSisLOW,anddisabledwithCSisHIGH.The device remains in the previous state when CSisHIGH. DQMLandDQMHcontrolthelowerandupperbytesoftheI/Obuffers.Inread mode,DQMLandDQMHcontroltheoutputbuffer.WhenDQMLorDQMHisLOW,the correspondingbufferbyteisenabled,andwhenHIGH,disabled.Theoutputsgoto theHIGHimpedancestatewhenDQML/DQMHisHIGH.Thisfunctioncorrespondsto OEinconventionalDRAMs.Inwritemode,DQMLandDQMHcontroltheinputbuffer. WhenDQMLorDQMHisLOW,thecorrespondingbufferbyteisenabled,anddata canbewrittentothedevice.WhenDQMLorDQMHisHIGH,inputdataismasked andcannotbewrittentothedevice.ForIS42S16160Donly. ForIS42S83200Donly. DataontheDataBusislatchedonDQpinsduringWritecommands,andbufferedfor outputafterReadcommands. RAS, in conjunction with CAS and WE, forms the device command. See the "CommandTruthTable"itemfordetailsondevicecommands. WE, in conjunction with RAS and CAS, forms the device command. See the "CommandTruthTable"itemfordetailsondevicecommands. Vddq is the output buffer power supply. Vdd is the device internal power supply. Vssq is the output buffer ground. Vss is the device internal ground.
BA0,BA1 CAS CKE
InputPin InputPin InputPin
CLK CS
InputPin InputPin
DQML, DQMH
InputPin
DQM DQ0-DQ7 or DQ0-DQ15 RAS WE Vddq Vdd Vssq Vss
InputPin Input/Output InputPin InputPin P owerSupplyPin P owerSupplyPin P owerSupplyPin P owerSupplyPin
6
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
GENERAL DESCRIPTION READ
TheREADcommandselectsthebankfromBA0,BA1inputs and starts a burst read access to an active row. Inputs A0A9(x8);A0-A8(x16)providesthestartingcolumnlocation. WhenA10isHIGH,thiscommandfunctionsasanAUTO PRECHARGE command. When the auto precharge is selected, the row being accessed will be precharged at theendoftheREADburst.Therowwillremainopenfor subsequentaccesseswhenAUTOPRECHARGEisnot selected.DQ'sreaddataissubjecttothelogiclevelon the DQM inputs two clocks earlier.When a given DQM signalwasregisteredHIGH,thecorrespondingDQ'swill be High-Z two clocks later. DQ's will provide valid data whentheDQMsignalwasregisteredLOW. PRECHARGEfunctioninconjunctionwithaspecificREAD orWRITEcommand.ForeachindividualREADorWRITE command, auto precharge is either enabled or disabled. AUTOPRECHARGEdoesnotapplyexceptinfull-page burst mode. Upon completion of the READ or WRITE burst, a precharge of the bank/row that is addressed is automatically performed.
AUTO REFRESH COMMAND
ThiscommandexecutestheAUTOREFRESHoperation. Therowaddressandbanktoberefreshedareautomatically generatedduringthisoperation. Thestipulatedperiod(trc)is requiredforasinglerefreshoperation,andnoothercommandscanbeexecutedduringthisperiod. Thiscommand isexecutedatleast8192timesforeveryTref.Duringan AUTOREFRESHcommand,addressbitsare"Don'tCare". ThiscommandcorrespondstoCBRAuto-refresh.
WRITE
A burst write access to an active row is initiated with the WRITEcommand.BA0,BA1inputsselectsthebank,and the starting column location is provided by inputs A0-A9 (x8);A0-A8(x16).WhetherornotAUTO-PRECHARGEis used is determined by A10. Therowbeingaccessedwillbeprechargedattheendof theWRITE burst, if AUTO PRECHARGE is selected. If AUTOPRECHARGEisnotselected,therowwillremain openforsubsequentaccesses. A memory array is written with corresponding input data onDQ'sandDQMinputlogiclevelappearingatthesame time.DatawillbewrittentomemorywhenDQMsignalis LOW.WhenDQMisHIGH,thecorrespondingdatainputs willbeignored,andaWRITEwillnotbeexecutedtothat byte/column location.
BURST TERMINATE
The BURSTTERMINATE command forcibly terminates the burst read and write operations by truncating either fixed-length or full-page bursts and the most recently registeredREADorWRITEcommandpriortotheBURST TERMINATE.
COMMAND INHIBIT
COMMANDINHIBITpreventsnewcommandsfrombeing executed.Operationsinprogressarenotaffected,apart fromwhethertheCLKsignalisenabled
NO OPERATION
WhenCSislow,theNOPcommandpreventsunwanted commands from being registered during idle or wait states.
PRECHARGE
The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. BA0,BA1canbeusedtoselectwhichbankisprecharged or they are treated as "Don't Care". A10 determined whether one or all banks are precharged. After executing this command, the next command for the selected bank(s)isexecutedafterpassageoftheperiodtRP, which istheperiodrequiredforbankprecharging.Onceabank has been precharged, it is in the idle state and must be activatedpriortoanyREADorWRITEcommandsbeing issued to that bank.
LOAD MODE REGISTER
DuringtheLOADMODEREGISTERcommandthemode registerisloadedfromA0-A12.Thiscommandcanonly be issued when all banks are idle.
ACTIVE COMMAND
When the ACTIVE COMMAND is activated, BA0, BA1 inputs selects a bank to be accessed, and the address inputsonA0-A12selectstherow.UntilaPRECHARGE command is issued to the bank, the row remains open for accesses.
AUTO PRECHARGE
TheAUTOPRECHARGEfunctionensuresthattheprecharge is initiated at the earliest valid stage within a burst. Thisfunctionallowsforindividual-bankprechargewithout requiringanexplicitcommand.A10toenabletheAUTO Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
7
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
COMMAND TRUTH TABLE
CKE Function n-1 Devicedeselect(DESL) H Nooperation(NOP) H Burststop(BST) H Read H Readwithautoprecharge H Write H Writewithautoprecharge H Bankactivate(ACT) H Prechargeselectbank(PRE) H Prechargeallbanks(PALL) H CBRAuto-Refresh(REF) H Self-Refresh(SELF) H Moderegisterset(MRS) H n x x x x x x x x x x H L x CS H L L L L L L L L L L L L RAS x H H H H H H L L L L L L CAS x H H L L L L H H H L L L WE x H L H H L L H L L H H L BA1 x x x V V V V V V x x x L BA0 x x x V V V V V V x x x L A10 x x x L H L H V L H x x L A12, A11 A9 - A0 x x x V V V V V x x x x V
Note:H=Vih,L=Vilx=VihorVil,V=ValidData.
DQM TRUTH TABLE
Function Datawrite/outputenable Datamask/outputdisable Upperbytewriteenable/outputenable Lowerbytewriteenable/outputenable Upperbytewriteinhibit/outputdisable Lowerbytewriteinhibit/outputdisable
Note:H=Vih,L=Vilx=VihorVil,V=ValidData.

CKE n-1 H H H H H H
n x x x x x x

DQMH L H L x H x

DQML L H x L x H
8
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
CKE TRUTH TABLE
CurrentState/Function ActivatingClocksuspendmodeentry AnyClocksuspendmode Clocksuspendmodeexit AutorefreshcommandIdle(REF) SelfrefreshentryIdle(SELF) PowerdownentryIdle Selfrefreshexit Powerdownexit
Note:H=Vih,L=Vilx=VihorVil,V=ValidData.

CKE n-1 n H L L L L H H H H L H L L H L H L H
CS x x x L L x L H x
RAS x x x L L x H x x
CAS x x x L L x H x x
WE x x x H H x H x x
Address x x x x x x x x x
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
9
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
FUNCTIONAL TRUTH TABLE
Current State Idle RowActive Read Write CS H L L L L L L L L H L L L L L L L L H L L L L L L L L H L L L L L L L L RAS CAS X H H H H L L L L X H H H H L L L L X H H H H L L L L X H H H H L L L L X H H L L H H L L X H H L L H H L L X H H L L H H L L X H H L L H H L L WE X H L H L H L H L X H L H L H L H L X H L H L H L H L X H L H L H L H L Address X X X BA,CA,A10 A,CA,A10 BA,RA BA,A10 X OC,BA1=L X X X BA,CA,A10 BA,CA,A10 BA,RA BA,A10 X OC,BA X X X BA,CA,A10 BA,CA,A10 BA,RA BA,A10 X OC,BA X X X BA,CA,A10 BA,CA,A10 BA,RA BA,A10 X OC,BA Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA RAACT PRE/PALL REF/SELF MRS Action NoporPowerDown(2) NoporPowerDown(2) NoporPowerDown ILLEGAL(3) ILLEGAL(3) Rowactivating Nop AutorefreshorSelf-refresh(4) Moderegisterset Nop Nop Nop Beginread(5) Beginwrite(5) ILLEGAL(3) Precharge Prechargeallbanks(6) ILLEGAL ILLEGAL Continuebursttoendto Rowactive ContinuebursttoendRow Rowactive Burststop,Rowactive Terminateburst, begin new read (7) Terminateburst, begin write (7,8) ILLEGAL(3) Terminateburst Precharging ILLEGAL ILLEGAL Continuebursttoend Writerecovering Continuebursttoend Writerecovering Burststop,Rowactive Terminateburst,startread: DetermineAP(7,8) Terminateburst,newwrite: DetermineAP(7) ILLEGAL(3) TerminateburstPrecharging(9) ILLEGAL ILLEGAL
Note:H=Vih,L=Vilx=VihorVil,V=ValidData,BA=BankAddress,CA+ColumnAddress,RA=RowAddress,OC=Op-Code
10
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
FUNCTIONAL TRUTH TABLE Continued:
Current State Readwithauto Precharging WritewithAuto Precharge Precharging RowActivating CS H L L L L L L L L H L L L L L L L L H L L L L L L L L H L L L L L L L L RAS CAS x H H H H L L L L x H H H H L L L L x H H H H L L L L x H H H H L L L L x H H L L H H L L x H H L L H H L L x H H L L H H L L x H H L L H H L L WE x H L H L H L H L x H L H L H L H L x H L H L H L H L x H L H L H L H L Address x x x BA,CA,A10 BA,CA,A10 BA,RA BA,A10 x OC,BA x x x BA,CA,A10 BA,CA,A10 BA,RA BA,A10 x OC,BA x x x BA,CA,A10 BA,CA,A10 BA,RA BA,A10 x OC,BA x x x BA,CA,A10 BA,CA,A10 BA,RA BA,A10 x OC,BA Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS Action Continuebursttoend,Precharge Continuebursttoend,Precharge ILLEGAL ILLEGAL(11) ILLEGAL(11) ILLEGAL(3) ILLEGAL(11) ILLEGAL ILLEGAL Continuebursttoend,Write recoveringwithautoprecharge Continuebursttoend,Write recovering with auto precharge ILLEGAL ILLEGAL(11) ILLEGAL(11) ILLEGAL(3,11) ILLEGAL(3,11) ILLEGAL ILLEGAL Nop,EnteridleaftertRP Nop,EnteridleaftertRP Nop,EnteridleaftertRP ILLEGAL(3) ILLEGAL(3) ILLEGAL(3) NopEnteridleaftertRP ILLEGAL ILLEGAL Nop,EnterbankactiveaftertRCD Nop,EnterbankactiveaftertRCD Nop,EnterbankactiveaftertRCD ILLEGAL(3) ILLEGAL(3) ILLEGAL(3,9) ILLEGAL(3) ILLEGAL ILLEGAL
Note:H=Vih,L=Vilx=VihorVil,V=ValidData,BA=BankAddress,CA+ColumnAddress,RA=RowAddress,OC=Op-Code
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
11
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
FUNCTIONAL TRUTH TABLE Continued:
Current State WriteRecovering WriteRecovering withAuto Precharge Refresh ModeRegister Accessing CS H L L L L L L L L H L L L L L L L L H L L L L L L L H L L L L RAS CAS x H H H H L L L L x H H H H L L L L x H H H L L L L x H H H L x H H L L H H L L x H H L L H H L L x H L L H H L L x H H L x WE x H L H L H L H L x H L H L H L H L x x H L H L H L x H L x x Address x x x BA,CA,A10 BA,CA,A10 BA,RA BA,A10 x OC,BA x x x BA,CA,A10 BA,CA,A10 BA,RA BA,A10 x OC,BA x x BA,CA,A10 BA,CA,A10 BA,RA BA,A10 x OC,BA x x x BA,CA,A10 BA,RA Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP/BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/WRITE Action Nop,EnterrowactiveaftertDPL Nop,EnterrowactiveaftertDPL Nop,EnterrowactiveaftertDPL Beginread(8) Beginnewwrite ILLEGAL(3) ILLEGAL(3) ILLEGAL ILLEGAL Nop,EnterprechargeaftertDPL Nop,EnterprechargeaftertDPL Nop,EnterrowactiveaftertDPL ILLEGAL(3,8,11) ILLEGAL(3,11) ILLEGAL(3,11) ILLEGAL(3,11) ILLEGAL ILLEGAL Nop,EnteridleaftertRC Nop,EnteridleaftertRC ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Nop,Enteridleafter2clocks Nop,Enteridleafter2clocks ILLEGAL ILLEGAL
ACT/PRE/PALL ILLEGAL REF/MRS
Note:H=Vih,L=Vilx=VihorVil,V=ValidData,BA=BankAddress,CA+ColumnAddress,RA=RowAddress,OC=Op-Code Notes: 1.AllentriesassumethatCKEisactive(CKEn-1=CKEn=H). 2.Ifbothbanksareidle,andCKEisinactive(Low),thedevicewillenterPowerDownmode.AllinputbuffersexceptCKEwillbe disabled. 3.Illegaltobankinspecifiedstates;FunctionmaybelegalinthebankindicatedbyBankAddress(BA),dependingonthestateof that bank. 4.Ifbothbanksareidle,andCKEisinactive(Low),thedevicewillenterSelf-Refreshmode.AllinputbuffersexceptCKEwillbe disabled. 5.IllegaliftRCDisnotsatisfied. 6.IllegaliftRASisnotsatisfied. 7.Mustsatisfyburstinterruptcondition. 8.Mustsatisfybuscontention,busturnaround,and/orwriterecoveryrequirements. 9.Mustmaskprecedingdatawhichdon'tsatisfytDPL. 10.IllegaliftRRDisnotsatisfied. 11. Illegal for single bank, but legal for other banks.
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Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
CKE RELATED COMMAND TRUTH TABLE(1)
Current State Operation n-1 Self-Refresh(S.R.) INVALID,CLK(n-1)wouldexitS.R. H Self-RefreshRecovery(2) L Self-RefreshRecovery(2) L Illegal L Illegal L MaintainS.R. L Self-RefreshRecoveryIdleAftertrc H Idle After trc H Illegal H Illegal H Beginclocksuspendnextcycle(5) H Beginclocksuspendnextcycle(5) H Illegal H Illegal H (2) Exitclocksuspendnextcycle L Maintainclocksuspend L Power-Down(P.D.) INVALID,CLK(n-1)wouldexitP.D. H EXITP.D.-->Idle(2) L Maintainpowerdownmode L AllBanksIdle RefertooperationsinOperativeCommandTable H RefertooperationsinOperativeCommandTable H RefertooperationsinOperativeCommandTable H Auto-Refresh H RefertooperationsinOperativeCommandTable H RefertooperationsinOperativeCommandTable H RefertooperationsinOperativeCommandTable H RefertooperationsinOperativeCommandTable H Self-Refresh(3) H RefertooperationsinOperativeCommandTable H Power-Down(3) L Anystate RefertooperationsinOperativeCommandTable H otherthan Beginclocksuspendnextcycle(4) H listedabove Exitclocksuspendnextcycle L Maintainclocksuspend L
CKE
n X H H H H L H H H H L L L L H L X H L H H H H H L L L L L X H L H L
CS X H L L L X H L L L H L L L X X X X X H L L L L H L L L L X X X X X
RAS X X H H L X X H H L X H H L X X X X X X H L L L X H L L L X X X X X
CAS X X H L X X X H L X X H L X X X X X X X X H L L X X H L L X X X X X
WE Address X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X -- X X X X X -- X -- X -- H X L Op-Code X -- X -- X -- H X L Op-Code X X X X X X X X X X
Notes: 1.H:Highlevel,L:lowlevel,X:Highorlowlevel(Don'tcare). 2.CKELowtoHightransitionwillre-enableCLKandotherinputsasynchronously.Aminimumsetup timemustbesatisfiedbeforeanycommandotherthanEXIT. 3.PowerdownandSelfrefreshcanbeenteredonlyfromthebothbanksidlestate. 4.MustbelegalcommandasdefinedinOperativeCommandTable. 5. Illegal if txsr is not satisfied.
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
STATE DIAGRAM
Self Refresh SELF SELFexit Mode Register Set MRS IDLE REF CBR(Auto) Refresh
CKE CKE ACT Power Down
Row Active BST
CKE CKE Read BST
Active Power Down
ith
rge
Write
Au to
Re
w
rite
W
to
WRITE SUSPEND
Au
CKE WRITE CKE
Pr
ec
Write
ha
Read CKE READ CKE
ith w ad arge h ec
Pr
Read
Write
READ SUSPEND
POWER ON
Precharge Precharge
PR E( Pr ec
ha
rge
WRITEA SUSPEND
ter
WRITEA
mi
CKE CKE
na
tio
RR E( Pre arg ch et ina erm tio n)
n)
CKE READA CKE
READA SUSPEND
Automaticsequence ManualInput
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Vdd max Vddq max Vin Vout Pd max Ics Topr Tstg Parameters MaximumSupplyVoltage MaximumSupplyVoltageforOutputBuffer InputVoltage OutputVoltage AllowablePowerDissipation output Shorted Current operatingTemperature Com. Ind. A1 A2 StorageTemperature Rating -0.5to+4.6 -0.5to+4.6 -0.5toVdd+0.5 -1.0toVddq+0.5 1 50 0 to +70 -40to+85 -40to+85 -40to+105 -65to+150 Unit V V V V W mA C C


Notes: 1. StressgreaterthanthoselistedunderABSOLUTEMAXIMUMRATINGSmaycausepermanentdamageto thedevice.Thisisastressratingonlyandfunctionaloperationofthedeviceattheseoranyotherconditions abovethoseindicatedintheoperationalsectionsofthisspecificationisnotimplied.Exposuretoabsolute maximumratingconditionsforextendedperiodsmayaffectreliability. 2. AllvoltagesarereferencedtoVss.
DC RECOMMENDED OPERATING CONDITIONS
(Ta=0oC to +70oCforCommercialgrade.Ta=-40oCto+85oCforIndustrialandA1grade.Ta=-40oC to +105oCforA2grade.) Symbol Vdd Vddq Vih(1) Vil(2) Parameter SupplyVoltage I/OSupplyVoltage InputHighVoltage InputLowVoltage Min. 3.0 3.0 2.0 -0.3 Typ. 3.3 3.3 -- -- Max. 3.6 3.6 Vddq +0.3 +0.8 Unit V V V V


Note: 1.Vih (overshoot): Vih (max)=Vddq +1.2V (pulse width < 3ns). 2.Vil (undershoot): Vih (min)=-1.2V (pulse width < 3ns). 3. AllvoltagesarereferencedtoVss.
CAPACITANCE CHARACTERISTICS (AtTa=0to+25C,Vdd=Vddq =3.30.3V)
Symbol Cin1 Cin2 CI/O Parameter InputCapacitance:CLK InputCapacitance:Allotherinputpins DataInput/OutputCapacitance:DQS Min. 2.5 2.5 4.0 Max. 3.5 3.8 6.0 Unit pF pF pF
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
DC ELECTRICAL CHARACTERISTICS 1 (RecommendedOperationConditionsunlessotherwisenoted.)
Symbol idd1 (1) idd2p idd2ps idd2n (2) Idd2ns idd3p idd3ps idd3n (2) Idd3ns idd4 idd5 idd6 Parameter OperatingCurrent PrechargeStandbyCurrent (InPower-DownMode) PrechargeStandbyCurrent (InPower-DownMode) PrechargeStandbyCurrent (InNonPower-DownMode) PrechargeStandbyCurrent (InNonPower-DownMode) ActiveStandbyCurrent (Power-DownMode) ActiveStandbyCurrent (Power-DownMode) Active Standby Current (InNonPower-DownMode) Active Standby Current (InNonPower-DownMode) OperatingCurrent Auto-RefreshCurrent Self-RefreshCurrent Test Condition Onebankactive,CL=3,BL=1, tclk=tclk(min),trc=trc(min) CKE Vil (max),tck=15ns CKE Vil (max),CLK Vil (max) CS Vcc-0.2V,CKE Vih (min) tck=15ns CS Vcc-0.2V,CKE Vih (min) or CKE Vil (max),Allinputsstable CKE Vil (max),tck=15ns CKE Vil (max),CLK Vil (max) CS Vcc-0.2V,CKE Vih (min) tck=15ns CS Vcc-0.2V,CKE Vih (min) or CKE Vil (max),Allinputsstable Allbanksactive,BL=4,CL=3, tck=tck(min) trc=trc(min),tclk=tclk(min) CKE 0.2V -6 140 3 3 35 20 4 3 55 30 180 180 3 -7 120 3 3 35 20 4 3 55 30 130 160 3 -75E 140 3 3 35 20 4 3 55 30 180 180 3 Unit mA mA mA mA mA mA mA mA mA mA mA mA
Notes: 1. Idd (max)isspecifiedattheoutputopencondition. 2. Inputsignalsarechangedonetimeduring30ns.
DC ELECTRICAL CHARACTERISTICS 2 (RecommendedOperationConditionsunlessotherwisenoted.)
Symbol iil iol Voh Vol Parameter InputLeakageCurrent OutputLeakageCurrent OutputHighVoltageLevel OutputLowVoltageLevel Test Condition 0VVinVcc,withpinsotherthan thetestedpinat0V Outputisdisabled,0VVoutVcc, Ioh=-2mA Iol=2mA Min -5 -5 2.4 -- Max 5 5 -- 0.4 Unit A A V V
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AC ELECTRICAL CHARACTERISTICS (1,2,3)
-6 Symbol tck3 tck2 tac3 tac2 tchi tcl toh3 toh2 tlz thz tds tdh tas tah tcks tckh tcs tch trc tras trp trcd trrd tdpl tdal tmrd tdde txsr tt tref CASLatency=3 CASLatency=2 AccessTimeFromCLK CASLatency=3 CASLatency=2 CLKHIGHLevelWidth CLKLOWLevelWidth OutputDataHoldTime CASLatency=3 CAS Latency=2 OutputLOWImpedanceTime OutputHIGHImpedanceTime (2) InputDataSetupTime InputDataHoldTime(2) AddressSetupTime(2) AddressHoldTime(2) CKESetupTime(2) (2) CKEHoldTime CommandSetupTime(CS, RAS, CAS, WE,DQM)(2) CommandHoldTime(CS, RAS, CAS, WE,DQM)(2) CommandPeriod(REFtoREF/ACTtoACT) CommandPeriod(ACTtoPRE) CommandPeriod(PREtoACT) ActiveCommandToRead/WriteCommandDelayTime CommandPeriod(ACT[0]toACT[1]) InputDataToPrecharge CommandDelaytime InputDataToActive/Refresh CommandDelaytime(DuringAuto-Precharge) ModeRegisterProgramTime PowerDownExitSetupTime Self-RefreshExitTime TransitionTime RefreshCycleTime(8192) Ta 70oCCom.,Ind.,A1,A2 Ta 85oCInd.,A1,A2 Ta >85oCA2 Parameter ClockCycleTime Min. 6 10 -- -- 2.5 2.5 2.7 2.7 0 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 60 42 18 18 12 12 30 12 6 70 0.3 -- -- -- Max. -- -- 5.4 6.5 -- -- -- -- -- 5.4 -- -- -- -- -- -- -- -- -- 100K -- -- -- -- -- -- -- -- 1.2 64 64 -- -7 Min. 7 10 -- -- 2.5 2.5 2.7 2.7 0 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 67.5 45 20 20 14 14 35 14 7 70 0.3 -- -- -- Max. -- -- 5.4 6.5 -- -- -- -- -- 5.4 -- -- -- -- -- -- -- -- -- 100K -- -- -- -- -- -- -- -- 1.2 64 64 16 -75E Min. -- 7.5 -- -- 2.5 2.5 -- 2.7 0 2.7 1.5 0.8 1.5 0.8 1.5 0.8 1.5 0.8 67.5 45 15 15 15 15 30 15 7.5 70 0.3 -- -- -- Max. -- -- -- 5.5 -- -- -- -- -- 5.4 -- -- -- -- -- -- -- -- -- 100K -- -- -- -- -- -- -- -- 1.2 64 64 16 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms ms ms


Notes: 1. Thepower-onsequencemustbeexecutedbeforestartingmemoryoperation. 2. measured with tt =1ns.Ifclockrisingtimeislongerthan1ns,(tr/2-0.5)nsshouldbeaddedtotheparameter. 3.Thereferencelevelis1.4Vwhenmeasuringinputsignaltiming.RiseandfalltimesaremeasuredbetweenVih(min.)andVil (max).
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
OPERATING FREQUENCY / LATENCY RELATIONSHIPS
SYMBOL PARAMETER -- -- tcac trcd trac trc tras trp trrd tccd tdpl tdal trbd twbd trql twdl tpql tqmd tdmd tmrd ClockCycleTime OperatingFrequency(CASLatency=3) CASLatency RASLatency(trcd + tcac) CommandPeriod(REFtoREF/ACTtoACT) CommandPeriod(ACTtoPRE) CommandPeriod(PREtoACT) CommandPeriod(ACT[0]toACT[1]) ColumnCommandDelayTime (READ,READA,WRIT,WRITA) InputDataToPrechargeCommandDelayTime CASLatency=3 CASLatency=2 6 166 3 3 6 -- 10 7 3 2 1 2 5 3 -- 0 3 -- 0 -2 -- 2 0 2 7 143 3 3 6 -- 10 7 3 2 1 2 5 3 -- 0 3 -- 0 -2 -- 2 0 2 7.5 133 2 2 -- 4 9 6 2 2 1 2 4 -- 2 0 -- 2 0 -- -1 2 0 2 10 100 2/3 2 5 4 7 5 2 2 1 2 4 3 2 0 3 2 0 -2 -1 2 0 2 UNITS ns MHz cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle cycle
ActiveCommandToRead/WriteCommandDelayTime
InputDataToActive/RefreshCommandDelayTime5 (DuringAuto-Precharge)
BurstStopCommandToOutputinHIGH-ZDelayTime
(Read)
CASLatency=3 CASLatency=2
BurstStopCommandToInputinInvalidDelayTime0 (Write)
PrechargeCommandToOutputinHIGH-ZDelayTime
(Read)
CASLatency=3 CASLatency=2
PrechargeCommandToInputinInvalidDelayTime0 (Write)
LastOutputToAuto-PrechargeStartTime(Read) CASLatency=3
CASLatency=2 DQMToOutputDelayTime(Read) DQMToInputDelayTime(Write) ModeRegisterSetToCommandDelayTime
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
AC TEST CONDITIONS Input Load
tCK tCHI
3.0V
Output Load
tCL
1.4V
CLK 1.4V
0V 3.0V
tCS
tCH
Z = 50 Output 50 pF
50
INPUT 1.4V
0V
tOH OUTPUT
1.4V
tAC
1.4V
AC TEST CONDITIONS
Parameter ACInputLevels InputRiseandFallTimes InputTimingReferenceLevel OutputTimingMeasurementReferenceLevel Rating 0Vto3.0V 1ns 1.4V 1.4V
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
FUNCTIONAL DESCRIPTION
The256MbSDRAMsarequad-bankDRAMswhichoperate at3.3Vandincludeasynchronousinterface(allsignals are registered on the positive edge of the clock signal, CLK).Eachofthe67,108,864-bitbanksisorganizedas 8,192rowsby512columnsby16bitsor8,192rowsby 1,024columnsby8bits. ReadandwriteaccessestotheSDRAMareburstoriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVEcommandwhichisthenfollowedbyaREADor WRITEcommand.Theaddressbitsregisteredcoincident withtheACTIVEcommandareusedtoselectthebank and row to be accessed (BA0andBA1selectthebank,A0A12selecttherow).TheaddressbitsA0-A9(x8);A0-A8(x16) registeredcoincidentwiththeREADorWRITEcommand are used to select the starting column location for the burst access. Prior to normal operation, the SDRAM must be initialized.Thefollowingsectionsprovidedetailedinformation coveringdeviceinitialization,registerdefinition,command descriptions and device operation.
Initialization
SDRAMs must be powered up and initialized in a predefined manner. The256MbSDRAMisinitializedafterthepowerisapplied toVddandVddq(simultaneously)andtheclockisstable withDQMHighandCKEHigh. A200sdelayisrequiredpriortoissuinganycommand other than a COMMANDINHIBIT or a NOP.TheCOMMAND INHIBITorNOPmaybeappliedduringthe200usperiodand should continue at least through the end of the period. WithatleastoneCOMMANDINHIBITorNOPcommand havingbeenapplied,aPRECHARGEcommandshould be applied once the 200s delay has been satisfied. All banksmustbeprecharged.Thiswillleaveallbanksinan idle state after which at least eight AUTOREFRESH cycles must be performed. After the AUTOREFRESH cycles are complete, the SDRAM is then ready for mode register programming. The mode register should be loaded prior to applying any operational command because it will power up in an unknown state.
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INITIALIzE AND LOAD MODE REGISTER(1)
T0 CLK
tCK
T1
Tn+1 tCH
To+1 tCL
Tp+1
Tp+2
Tp+3
tCKS tCKH CKE tCMH tCMS COMMAND DQM/ DQML, DQMH tAS tAH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 DQ T Power-up: VCC and CLK stable T = 200s Min. tRP Precharge all banks tRC AUTO REFRESH tRC AUTO REFRESH tMRD Program MODE REGISTER (2, 3, 4) DON'T CARE ALL BANKS CODE tAS tAH CODE tAS tAH CODE BANK ROW ROW NOP tCMH tCMS PRECHARGE tCMH tCMS
AUTO REFRESH
NOP
AUTO REFRESH
NOP
Load MODE REGISTER
NOP
ACTIVE
At least 8 Auto-Refresh Commands
Notes: 1. If CSisHighatclockHightime,allcommandsappliedareNOP. 2.TheModeregistermaybeloadedpriortotheAuto-Refreshcyclesifdesired. 3.JEDECandPC100specifythreeclocks. 4.OutputsareguaranteedHigh-Zafterthecommandisissued.
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
AUTO-REFRESH CYCLE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/ DQML, DQMH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK BA0, BA1 DQ BANK(s) tAS tAH High-Z tRP tRC tRC DON'T CARE
Notes: 1. CASlatency=2,3
tCK
T1
tCL
T2
tCH
Tn+1
To+1
PRECHARGE
NOP
Auto Refresh
NOP
Auto Refresh
NOP
ACTIVE
ROW ROW BANK
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
SELF-REFRESH CYCLE
T0 CLK tCK tCKS tCKH CKE tCMS tCMH COMMAND DQM/ DQML, DQMH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK tAS tAH BA0, BA1 BANK PRECHARGE
T1 tCH tCL
T2 tCKS
Tn+1
To+1
To+2
tRAS tCKS
NOP
Auto Refresh
NOP
NOP
Auto Refresh
DQ High-Z Precharge all active banks
tRP Enter self refresh mode
tXSR CLK stable prior to exiting Exit self refresh mode self refresh mode (Restart refresh time base) DON'T CARE
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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
REGISTER DEFINITION Mode Register
The mode register is used to define the specific mode ofoperationoftheSDRAM.Thisdefinitionincludesthe selection of a burst length, a burst type, a CAS latency, an operating mode and a write burst mode, as shown in MODEREGISTERDEFINITION. ThemoderegisterisprogrammedviatheLOADMODE REGISTERcommandandwillretainthestoredinformation until it is programmed again or the device loses power. Mode register bits M0-M2 specify the burst length, M3 specifies the type of burst (sequentialorinterleaved),M4-M6 specifytheCASlatency,M7andM8specifytheoperating mode,M9specifiestheWRITEburstmode,andM10,M11, andM12arereservedforfutureuse. The mode register must be loaded when all banks are idle, and the controller must wait the specified time before initiatingthesubsequentoperation.Violatingeitherofthese requirementswillresultinunspecifiedoperation.
MODE REGISTER DEFINITION
BA1 BA0 A12 A11 A10
(1)
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Address Bus (Ax) Mode Register (Mx)
Reserved
Burst Length M2 0 0 0 0 1 1 1 1 Burst Type M3 0 1 Latency Mode M6 M5 M4 0 0 0 0 1 1 1 1 Operating Mode M8 M7 00 ---- M6-M0 Defined -- Mode Standard Operation All Other States Reserved 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 CAS Latency Reserved Reserved 2 3 Reserved Reserved Reserved Reserved Type Sequential Interleaved M1 0 0 1 1 0 0 1 1 M0 0 1 0 1 0 1 0 1 M3=0 1 2 4 8 Reserved Reserved Reserved Full Page M3=1 1 2 4 8 Reserved Reserved Reserved Reserved
Write Burst Mode M9 0 1 Mode Programmed Burst Length Single Location Access
1. To ensure compatibility with future devices, should program BA1, BA0, A12, A11, A10 = "0"
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BURST LENGTH
ReadandwriteaccessestotheSDRAMareburstoriented, with the burst length being programmable, as shown in MODEREGISTERDEFINITION.Theburstlengthdeterminesthemaximumnumberofcolumnlocationsthatcan beaccessedforagivenREADorWRITEcommand.Burst lengthsof1,2,4or8locationsareavailableforboththe sequentialandtheinterleavedbursttypes,andafull-page burst is available for the sequential type.The full-page burstisusedinconjunctionwiththeBURSTTERMINATE command to generate arbitrary burst lengths. Reservedstatesshouldnotbeused,asunknownoperation or incompatibility with future versions may result. WhenaREADorWRITEcommandisissued,ablockof columnsequaltotheburstlengthiseffectivelyselected.All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached.TheblockisuniquelyselectedbyA1-A8(x16)or A1-A9(x8)whentheburstlengthissettotwo;byA2-A8 (x16)orA2-A9(x8)whentheburstlengthissettofour; andbyA3-A8(x16)orA3-A9(x8)whentheburstlength issettoeight.Theremaining(leastsignificant)address bit(s) is (are) used to select the starting location within the block. Full-page bursts wrap within the page if the boundary is reached.
BurstType
Accesses within a given burst may be programmed to be eithersequentialorinterleaved;thisisreferredtoasthe bursttypeandisselectedviabitM3. Theorderingofaccesseswithinaburstisdeterminedby the burst length, the burst type and the starting column address,asshowninBURSTDEFINITIONtable.
BURST DEFINITION
Burst Length Starting Column Address A0 2 0 1 A1 A0 0 0 4 0 1 1 0 1 1 A2 A1 A0 0 0 0 0 0 1 0 1 0 8 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 Full n=A0-A8(x16) Page n=A0-A9(x8) (y) (location0-y) Order of Accesses Within a Burst Type = Sequential Type = Interleaved 0-1 1-0 0-1-2-3 1-2-3-0 2-3-0-1 3-0-1-2 0-1-2-3-4-5-6-7 1-2-3-4-5-6-7-0 2-3-4-5-6-7-0-1 3-4-5-6-7-0-1-2 4-5-6-7-0-1-2-3 5-6-7-0-1-2-3-4 6-7-0-1-2-3-4-5 7-0-1-2-3-4-5-6 Cn,Cn+1,Cn+2 Cn+3,Cn+4... ...Cn-1, Cn... 0-1 1-0 0-1-2-3 1-0-3-2 2-3-0-1 3-2-1-0 0-1-2-3-4-5-6-7 1-0-3-2-5-4-7-6 2-3-0-1-6-7-4-5 3-2-1-0-7-6-5-4 4-5-6-7-0-1-2-3 5-4-7-6-1-0-3-2 6-7-4-5-2-3-0-1 7-6-5-4-3-2-1-0 NotSupported

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IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
CAS Latency
The CAS latency is the delay, in clock cycles, between the registrationofaREADcommandandtheavailabilityof thefirstpieceofoutputdata.Thelatencycanbesettotwoor three clocks. IfaREADcommandisregisteredatclockedgen,and the latency is m clocks, the data will be available by clock edge n + m.TheDQswillstartdrivingasaresultofthe clock edge one cycle earlier (n + m -1),andprovidedthat the relevant access times are met, the data will be valid by clock edge n + m.Forexample,assumingthattheclock cycle time is such that all relevant access times are met, ifaREADcommandisregisteredatT0andthelatency isprogrammedtotwoclocks,theDQs willstartdriving afterT1andthedatawillbevalidbyT2,asshowninCAS Latency diagrams.The Allowable Operating Frequency tableindicatestheoperatingfrequenciesatwhicheach CAS latency setting can be used. Reservedstatesshouldnotbeusedasunknownoperation or incompatibility with future versions may result.
Operating Mode
ThenormaloperatingmodeisselectedbysettingM7andM8 tozero;theothercombinationsofvaluesforM7andM8are reservedforfutureuseand/ortestmodes.Theprogrammed burstlengthappliestobothREADandWRITEbursts. Testmodesandreservedstatesshouldnotbeusedbecause unknown operation or incompatibility with future versions may result.
Write Burst Mode
WhenM9=0,theburstlengthprogrammedviaM0-M2 appliestobothREADandWRITEbursts;whenM9=1, theprogrammedburstlengthappliestoREADbursts,but writeaccessesaresingle-location(nonburst)accesses.
CAS Latency Allowable Operating Frequency (MHz)
Speed -6 -7 -75E CAS Latency = 2 100 100 133 CAS Latency = 3 166 143 --
CAS LATENCY
T0 CLK T1 T2 T3
COMMAND DQ
READ
NOP tAC
NOP DOUT
tLZ CAS Latency - 2
tOH
T0 CLK
T1
T2
T3
T4
COMMAND DQ
READ
NOP
NOP tAC
NOP DOUT
tLZ CAS Latency - 3
tOH DON'T CARE UNDEFINED
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CHIP OPERATION BANK/ROW ACTIVATION
Before any READ orWRITE commands can be issued toabankwithintheSDRAM,arowinthatbankmustbe "opened."ThisisaccomplishedviatheACTIVEcommand, which selects both the bank and the row to be activated (see ActivatingSpecificRowWithinSpecificBank). After opening a row (issuinganACTIVEcommand),aREAD orWRITEcommandmaybeissuedtothatrow,subjectto the trcdspecification.Minimumtrcd should be divided by theclockperiodandroundeduptothenextwholenumber to determine the earliest clock edge after the ACTIVE commandonwhichaREADorWRITEcommandcanbe entered.Forexample,atrcd specification of 15ns with a 143MHzclock(7nsperiod)resultsin2.14clocks,rounded to3.Thisisreflectedinthefollowingexample,whichcoversanycasewhere2<[trcd(MIN)/tck] 3.(Thesame procedure is used to convert other specification limits from timeunitstoclockcycles). AsubsequentACTIVEcommandtoadifferentrowinthe same bank can only be issued after the previous active rowhasbeen"closed"(precharged).Theminimumtime interval between successive ACTIVE commands to the same bank is defined by trc. AsubsequentACTIVEcommandtoanotherbankcanbe issued while the first bank is being accessed, which results inareductionoftotalrow-accessoverhead.Theminimum timeintervalbetweensuccessiveACTIVEcommandsto different banks is defined by trrd.
ACTIVATING SPECIFIC ROW WITHIN SPECIFIC BANK
CLK HIGH CKE CS RAS CAS WE A0-A12 BA0, BA1 ROW ADDRESS BANK ADDRESS
EXAMPLE: MEETING TRCD (MIN) WHEN 2 < [TRCD (MIN)/TCK] 3
T0 CLK
T1
T2
T3
T4
COMMAND
ACTIVE
NOP tRCD
NOP
READ or WRITE
DON'T CARE
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READS
READ bursts are initiated with a READ command, as shownintheREADCOMMANDdiagram. Thestartingcolumnandbankaddressesareprovidedwith theREADcommand,andautoprechargeiseitherenabledor disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion of theburst.ForthegenericREADcommandsusedinthefollowing illustrations, auto precharge is disabled. DuringREADbursts,thevaliddata-outelementfromthe starting column address will be available following the CASlatencyaftertheREADcommand.Eachsubsequent data-outelementwillbevalidbythenextpositiveclock edge.The CAS Latency diagram shows general timing for each possible CAS latency setting. Uponcompletionofaburst,assumingnoothercommands havebeeninitiated,theDQswillgoHigh-Z.Afull-pageburst will continue until terminated. (At the end of the page, it will wraptocolumn0andcontinue.) DatafromanyREADburstmaybetruncatedwithasubsequentREADcommand,anddatafromafixed-length READburstmaybeimmediatelyfollowedbydatafroma READcommand.Ineithercase,acontinuousflowofdata canbemaintained.Thefirstdataelementfromthenew burst follows either the last element of a completed burst or the last desired data element of a longer burst which is being truncated. ThenewREADcommandshouldbeissuedx cycles before the clock edge at which the last desired data element is valid, where x equalstheCASlatencyminusone.Thisis showninConsecutiveREADBurstsforCASlatenciesof twoandthree;dataelementn +3iseitherthelastofa burstoffourorthelastdesiredofalongerburst.The256Mb SDRAMusesapipelinedarchitectureandthereforedoes notrequirethe2n rule associated with a prefetch architecture.AREADcommandcanbeinitiatedonanyclockcycle followingapreviousREADcommand.Full-speedrandom read accesses can be performed to the same bank, as showninRandomREADAccesses,oreachsubsequent READmaybeperformedtoadifferentbank. DatafromanyREADburstmaybetruncatedwithasubsequent WRITE command, and data from a fixed-length READburstmaybeimmediatelyfollowedbydatafroma WRITEcommand(subjecttobusturnaroundlimitations). TheWRITEburstmaybeinitiatedontheclockedgeimmediatelyfollowingthelast(orlastdesired)dataelement fromtheREADburst,providedthatI/Ocontentioncanbe avoided. In a given system design, there may be a possibilitythatthedevicedrivingtheinputdatawillgoLow-Z beforetheSDRAMDQsgoHigh-Z.Inthiscase,atleast a single-cycle delay should occur between the last read dataandtheWRITEcommand. 28
READ COMMAND
CLK CKE CS RAS CAS WE A0-A9 A11, A12
AUTO PRECHARGE COLUMN ADDRESS HIGH
A10
NO PRECHARGE
BA0, BA1
BANK ADDRESS
Note:A9is"Don'tCare"forx16.
TheDQMinputisusedtoavoidI/Ocontention,asshown inFiguresRW1andRW2.TheDQMsignalmustbeasserted (HIGH) at least three clocks prior to theWRITE command(DQMlatencyistwoclocksforoutputbuffers) to suppress data-out from the READ. Once theWRITE commandisregistered,theDQswillgoHigh-Z(orremain High-Z),regardlessofthestateoftheDQMsignal,provided theDQMwasactiveontheclockjustpriortotheWRITE commandthattruncatedtheREADcommand.Ifnot,the secondWRITEwillbeaninvalidWRITE.Forexample,if DQMwasLOWduringT4inFigureRW2,thentheWRITEs atT5andT7wouldbevalid,whiletheWRITEatT6would be invalid. TheDQMsignalmustbede-assertedpriortotheWRITE command(DQMlatencyiszeroclocksforinputbuffers) to ensure that the written data is not masked. Afixed-lengthREADburstmaybefollowedby,ortruncated with, a PRECHARGE command to the same bank (provided thatautoprechargewasnotactivated), and a full-page burst maybetruncatedwithaPRECHARGEcommandtothe samebank.ThePRECHARGEcommandshouldbeissued x cycles before the clock edge at which the last desired data element is valid, where x equals the CAS latency minusone.ThisisshownintheREADtoPRECHARGE
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diagramforeachpossibleCASlatency;dataelementn + 3iseitherthelastofaburstoffourorthelastdesiredof alongerburst.FollowingthePRECHARGEcommand,a subsequentcommandtothesamebankcannotbeissued until trpismet.Notethatpartoftherowprechargetimeis hiddenduringtheaccessofthelastdataelement(s). In the case of a fixed-length burst being executed to completion, a PRECHARGE command issued at the optimum time (as described above) provides the same operation that would result from the same fixed-length burstwithautoprecharge.ThedisadvantageofthePRECHARGEcommandisthatitrequiresthatthecommand and address buses be available at the appropriate time to issuethecommand;theadvantageofthePRECHARGE commandisthatitcanbeusedtotruncatefixed-length or full-page bursts. Full-pageREADburstscanbetruncatedwiththeBURST TERMINATE command, and fixed-length READ bursts maybetruncatedwithaBURSTTERMINATEcommand, providedthatautoprechargewasnotactivated.TheBURST TERMINATEcommandshouldbeissuedx cycles before the clock edge at which the last desired data element is valid, where x equalstheCASlatencyminusone.Thisis shownintheREADBurstTerminationdiagramforeach possibleCASlatency;dataelementn +3isthelastdesired data element of a longer burst.
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RW1 - READ to WRITE
T0 CLK
T1
T2
T3
T4
T5
T6
DQM
COMMAND
READ
NOP
NOP
NOP
NOP
NOP
WRITE
ADDRESS
BANK, COL n
BANK, COL b
tHZ DQ CAS Latency - 2 DON'T CARE DOUT n
DOUT n+1 DOUT n+2
DIN b tDS
RW2 - READ to WRITE
T0 CLK
T1
T2
T3
T4
T5
DQM
COMMAND
READ
NOP
NOP
NOP
NOP
WRITE
ADDRESS
BANK, COL n
BANK, COL b
DQ CAS Latency - 3
tHZ DOUT n
DIN b tDS DON'T CARE
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CONSECUTIVE READ BURSTS
T0 CLK
T1
T2
T3
T4
T5
T6
COMMAND
READ
NOP
NOP
NOP
READ
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL b
DQ CAS Latency - 2
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
DOUT b DON'T CARE
T0 CLK
T1
T2
T3
T4
T5
T6
T7
COMMAND
READ
NOP
NOP
NOP
READ
NOP
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL b
DQ CAS Latency - 3
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
DOUT b DON'T CARE
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RANDOM READ ACCESSES
T0 CLK
T1
T2
T3
T4
T5
COMMAND
READ
READ
READ
READ
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL b
BANK, COL m
BANK, COL x
DQ CAS Latency - 2
DOUT n
DOUT b
DOUT m
DOUT x DON'T CARE
T0 CLK
T1
T2
T3
T4
T5
T6
COMMAND
READ
READ
READ
READ
NOP
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL b
BANK, COL m
BANK, COL x
DQ CAS Latency - 3
DOUT n
DOUT b
DOUT m
DOUT x DON'T CARE
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READ BURST TERMINATION
T0 CLK
T1
T2
T3
T4
T5
T6
COMMAND
READ
NOP
NOP
NOP
BURST TERMINATE
NOP
NOP
x = 1 cycle
ADDRESS
BANK a, COL n
DQ CAS Latency - 2
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3 DON'T CARE
T0 CLK
T1
T2
T3
T4
T5
T6
T7
COMMAND
READ
NOP
NOP
NOP
BURST TERMINATE
NOP x = 2 cycles
NOP
NOP
ADDRESS
BANK, COL n
DQ CAS Latency - 3
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3 DON'T CARE
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ALTERNATING BANK READ ACCESSES
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/ DQML, DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 ROW tAS tAH ROW tAS tAH BANK 0 ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
READ tCMS tCMH
NOP
ACTIVE
NOP
READ
NOP
ACTIVE
COLUMN m(2) ENABLE AUTO PRECHARGE
ROW ROW
COLUMN b(2) ENABLE AUTO PRECHARGE
ROW ROW
BANK 0 tLZ
BANK 3 tOH DOUT m tAC tAC tOH DOUT m+1 tAC
BANK 3 tOH DOUT m+2 tAC tRP - BANK 0 tRCD - BANK 3 CAS Latency - BANK 3 tOH DOUT m+3 tAC
BANK 0 tOH DOUT b tAC tRCD - BANK 0
DQ tRCD - BANK 0 tRRD tRAS - BANK 0 tRC - BANK 0 CAS Latency - BANK 0
DON'T CARE
Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
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READ - FULL-PAGE BURST
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/ DQML, DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 DQ ROW tAS tAH ROW tAS tAH BANK
ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
Tn+1
Tn+2
Tn+3
Tn+4
NOP
READ
NOP
NOP
NOP
NOP
NOP
BURST TERM
NOP
NOP
tCMS tCMH
COLUMN m(2)
BANK tAC tLZ tRCD CAS Latency DOUT m tAC tAC DOUT m+1 tAC DOUT m+2 tAC DOUT m-1 tAC DOUT m tHZ DOUT m+1 tOH DON'T CARE UNDEFINED
tOH tOH tOH tOH tOH each row (x16) has 512 locations(3) Full page Full-page burst not self-terminating. completion Use BURST TERMINATE command.
Notes: 1) CAS latency = 2, Burst Length = Full Page 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" 3) x8: Each row has 1,024 locations.
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READ - DQM OPERATION
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/ DQML, DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 DQ ROW tAS tAH ROW tAS tAH BANK ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
READ tCMS tCMH
NOP
NOP
NOP
NOP
NOP
NOP
COLUMN m(2)
ENABLE AUTO PRECHARGE
DISABLE AUTO PRECHARGE
BANK tAC tLZ tRCD CAS Latency tOH DOUT m tHZ tLZ tAC tOH DOUT m+2 tAC tOH DOUT m+3 tHZ DON'T CARE UNDEFINED
Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
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READ to PRECHARGE
T0 CLK
T1
T2
T3
T4
T5 tRP
T6
T7
COMMAND
READ
NOP
NOP
NOP
PRECHARGE
NOP
ACTIVE
NOP
ADDRESS
BANK a, COL n
BANK (a or all)
BANK a, ROW
tRQL DQ CAS Latency - 2 DOUT n DOUT n+1 DOUT n+2 DOUT n+3
High-Z
DON'T CARE
T0 CLK
T1
T2
T3
T4
T5 tRP
T6
T7
COMMAND
READ
NOP
NOP
NOP
PRECHARGE
NOP
NOP
ACTIVE
ADDRESS
BANK, COL n
BANK, COL b
BANK a, ROW
tRQL DQ CAS Latency - 3 DOUT n DOUT n+1 DOUT n+2 DOUT n+3
High-Z
DON'T CARE
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WRITES
WRITEburstsareinitiatedwithaWRITEcommand,as showninWRITECommanddiagram. AnexampleisshowninWRITEtoWRITEdiagram.Data n + 1 is either the last of a burst of two or the last desired ofalongerburst.The256MbSDRAMusesapipelined architectureandthereforedoesnotrequirethe2n rule associatedwithaprefetcharchitecture.AWRITEcommand can be initiated on any clock cycle following a previous WRITEcommand.Full-speedrandomwriteaccesseswithin a page can be performed to the same bank, as shown in RandomWRITECycles,oreachsubsequentWRITEmay be performed to a different bank. DataforanyWRITEburstmaybetruncatedwithasubsequentREADcommand,anddataforafixed-lengthWRITE burstmaybeimmediatelyfollowedbyasubsequentREAD command.OncetheREADcommandisregistered,the datainputswillbeignored,andWRITEswillnotbeexecuted.AnexampleisshowninWRITEtoREAD.Datan + 1 is either the last of a burst of two or the last desired of a longer burst. Data for a fixed-length WRITE burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated), and a full-pageWRITE burst may be truncated with a PRECHARGE command to the same bank.The PRECHARGEcommandshouldbeissuedtdpl after the clock edge at which the last desired input data element isregistered.Theautoprechargemoderequiresatdpl of atleastoneclockplustime,regardlessoffrequency.In addition,whentruncatingaWRITEburst,theDQMsignal must be used to mask input data for the clock edge prior to,andtheclockedgecoincidentwith,thePRECHARGE command.AnexampleisshownintheWRITEtoPRECHARGEdiagram.Datan+1 is either the last of a burst oftwoorthelastdesiredofalongerburst.Followingthe PRECHARGEcommand,asubsequentcommandtothe same bank cannot be issued until trp is met. Inthecaseofafixed-lengthburstbeingexecutedtocompletion, a PRECHARGE command issued at the optimum time (asdescribedabove) provides the same operation that wouldresultfromthesamefixed-lengthburstwithauto precharge.ThedisadvantageofthePRECHARGE command isthatitrequiresthatthecommandandaddressbusesbe availableattheappropriatetimetoissuethecommand;the advantageofthePRECHARGEcommandisthatitcanbe usedtotruncatefixed-lengthorfull-pagebursts. Fixed-lengthorfull-pageWRITEburstscanbetruncated withtheBURSTTERMINATEcommand.WhentruncatingaWRITEburst,theinputdataappliedcoincidentwith theBURSTTERMINATEcommandwillbeignored.The lastdatawritten(providedthatDQMisLOWatthattime) will be the input data applied one clock previous to the BURSTTERMINATEcommand.ThisisshowninWRITE BurstTermination,wheredatan is the last desired data element of a longer burst. Integrated Silicon Solution, Inc. -- www.issi.com
WRITE COMMAND
CLK CKE CS RAS CAS WE A0-A9 A11, A12
AUTO PRECHARGE COLUMN ADDRESS HIGH
A10
NO PRECHARGE
BA0, BA1
BANK ADDRESS
Note:A9is"Don'tCare"forx16.
Thestartingcolumnandbankaddressesareprovidedwith theWRITEcommand,andautoprechargeiseitherenabled or disabled for that access. If auto precharge is enabled, the row being accessed is precharged at the completion of theburst.ForthegenericWRITEcommandsusedinthe following illustrations, auto precharge is disabled. DuringWRITEbursts,thefirstvaliddata-in element will be registered coincident with the WRITEcommand.Subsequent data elements will be registered on each successive positiveclockedge.Uponcompletionofafixed-lengthburst, assuming no other commands have been initiated, the DQswillremainHigh-Zandanyadditionalinputdatawill beignored(seeWRITEBurst).Afull-pageburstwillcontinue until terminated. (At the end of the page, it will wrap tocolumn0andcontinue.) DataforanyWRITEburstmaybetruncatedwithasubsequentWRITEcommand,anddataforafixed-lengthWRITE burst may be immediately followed by data for a WRITE command. The new WRITE command can be issued on anyclockfollowingthepreviousWRITEcommand,andthe data provided coincident with the new command applies to the new command. 38
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WRITE BURST
T0 CLK T1 T2 T3
COMMAND
WRITE
NOP
NOP
NOP
ADDRESS
BANK, COL n
DQ
DIN n
DIN n+1 DON'T CARE
WRITE TO WRITE
T0 CLK T1 T2
COMMAND
WRITE
NOP
WRITE
ADDRESS
BANK, COL n
BANK, COL b
DQ
DIN n
DIN n+1
DIN b DON'T CARE
RANDOM WRITE CYCLES
T0 CLK T1 T2 T3
COMMAND
WRITE
WRITE
WRITE
WRITE
ADDRESS
BANK, COL n
BANK, COL b
BANK, COL m
BANK, COL x
DQ
DIN n
DIN b
DIN m
DIN x
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WRITE to READ
T0 CLK
T1
T2
T3
T4
T5
COMMAND
WRITE
NOP
READ
NOP
NOP
NOP
ADDRESS
BANK, COL n
BANK, COL b
DQ
DIN n
DIN n+1 CAS Latency - 2
DOUT b
DOUT b+1 DON'T CARE
WP1 - WRITE to PRECHARGE
T0 CLK T1 T2 T3 T4 T5 T6
DQM tRP COMMAND WRITE NOP NOP
PRECHARGE
NOP
ACTIVE
NOP
ADDRESS
BANK a, COL n
BANK (a or all)
BANK a, ROW
tDPL DQ DIN n DIN n+1 DIN n+2 DON'T CARE
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WP2 - WRITE to PRECHARGE
T0 CLK T1 T2 T3 T4 T5 T6
DQM tRP COMMAND WRITE NOP NOP
PRECHARGE
NOP
NOP
ACTIVE
ADDRESS
BANK a, COL n
BANK (a or all)
BANK a, ROW
tDPL DQ DIN n DIN n+1 DON'T CARE
WRITE Burst Termination
T0 CLK
T1
T2
COMMAND
WRITE
BURST TERMINATE
NEXT COMMAND
ADDRESS
BANK, COL n
(ADDRESS)
DQ
DIN n
(DATA) DON'T CARE
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WRITE - FULL PAGE BURST
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 DQ tRCD ROW tAS tAH ROW tAS tAH BANK BANK tDS tDH DIN m tDS tDH DIN m+1 tDS tDH DIN m+2 tDS tDH tDS tDH tDS tDH DIN m+3 DIN m-1 DON'T CARE COLUMN m(2)
ACTIVE NOP WRITE NOP NOP NOP NOP BURST TERM NOP
T1 tCK tCL
T2 tCH
T3
T4
T5
Tn+1
Tn+2
tCMS tCMH
Full page completed
Notes: 1) Burst Length = Full Page 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
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WRITE - DQM OPERATION
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 DQ ROW tAS tAH ROW tAS tAH BANK ACTIVE tCK
T1 tCL
T2 tCH
T3
T4
T5
T6
T7
NOP
WRITE tCMS tCMH
NOP
NOP
NOP
NOP
NOP
COLUMN m(2)
ENABLE AUTO PRECHARGE
DISABLE AUTO PRECHARGE
BANK tDS tDH tDS tDH DIN m+2 tDS tDH DIN m tRCD DIN m+3 DON'T CARE
Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
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ALTERNATING BANK WRITE ACCESSES
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 ROW tAS tAH ROW tAS tAH BANK 0 ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
T9
NOP
WRITE tCMS tCMH
NOP
ACTIVE
NOP
WRITE
NOP
NOP
ACTIVE
COLUMN m(2) ENABLE AUTO PRECHARGE
ROW ROW
COLUMN b(2) ENABLE AUTO PRECHARGE
ROW ROW
BANK 0 tDS tDH tDS tDH DIN m+1
BANK 1 tDS tDH DIN m+2 tDS tDH
BANK 1 tDS tDH DIN b tDS tDH tDS tDH
BANK 0 tDS tDH
DQ tRCD - BANK 0 tRRD tRAS - BANK 0 tRC - BANK 0
DIN m
DIN m+3
DIN b+1
DIN b+2
DIN b+3 tRCD - BANK 0 tDPL - BANK 1
tDPL - BANK 0 tRCD - BANK 1
tRP - BANK 0
DON'T CARE
Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
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CLOCK SUSPEND
Clock suspend mode occurs when a column access/burst isinprogressandCKEisregisteredLOW.Intheclock suspendmode,theinternalclockisdeactivated,"freezing" the synchronous logic. ForeachpositiveclockedgeonwhichCKEissampled LOW,thenextinternalpositiveclockedgeissuspended. Any command or data present on the input pins at the time ofasuspendedinternalclockedgeisignored;anydata presentontheDQpinsremainsdriven;andburstcounters are not incremented, as long as the clock is suspended. (Seefollowingexamples.) ClocksuspendmodeisexitedbyregisteringCKEHIGH; the internal clock and related operation will resume on the subsequentpositiveclockedge.
Clock Suspend During WRITE Burst
T0 CLK T1 T2 T3 T4 T5
CKE INTERNAL CLOCK COMMAND NOP WRITE NOP NOP
ADDRESS
BANK a, COL n
DQ
DIN n
DIN n+1
DIN n+2 DON'T CARE
Clock Suspend During READ Burst
T0 CLK T1 T2 T3 T4 T5 T6
CKE INTERNAL CLOCK COMMAND READ NOP NOP NOP NOP NOP
ADDRESS
BANK a, COL n
DQ
DOUT n
DOUT n+1
DOUT n+2
DOUT n+3
DON'T CARE
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CLOCK SUSPEND MODE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 tAS tAH BA0, BA1 BANK COLUMN m(2) tAS tAH READ
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
T9
tCKS tCKH
NOP tCMS tCMH
NOP
NOP
NOP
NOP
WRITE
NOP
COLUMN n(2)
BANK tAC tAC DOUT m tLZ tOH DON'T CARE UNDEFINED tHZ DOUT m+1 tDS tDH DIN e DIN e+1
DQ
Notes: 1) CAS latency = 3, Burst Length = 2, Auto Precharge is disabled. 2) X16: A9, A11, and A12 = "Don't Care" X8: A11 and A12 = "Don't Care"
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PRECHARGE
ThePRECHARGEcommand(seefigure)isusedtodeactivate the open row in a particular bank or the open row in allbanks.Thebank(s)willbeavailableforasubsequentrow access some specified time (trp)afterthePRECHARGE command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only onebankistobeprecharged,inputsBA0,BA1selectthe bank.Whenallbanksaretobeprecharged,inputsBA0, BA1aretreatedas"Don'tCare."Onceabankhasbeen precharged, it is in the idle state and must be activated priortoanyREADorWRITEcommandsbeingissuedto that bank.
PRECHARGE Command
CLK CKE CS RAS CAS WE A0-A9, A11, A12
ALL BANKS HIGH
POWER-DOWN
Power-downoccursifCKEisregisteredLOWcoincident withaNOPorCOMMANDINHIBITwhennoaccesses are in progress. If power-down occurs when all banks are idle,thismodeisreferredtoasprechargepower-down; if power-down occurs when there is a row active in either bank, this mode is referred to as active power-down. Entering power-down deactivates the input and output buffers,excludingCKE,formaximumpowersavingswhile instandby.Thedevicemaynotremaininthepower-down statelongerthantherefreshperiod(64ms)sincenorefresh operations are performed in this mode. Thepower-downstateisexitedbyregisteringaNOPor COMMANDINHIBITandCKEHIGHatthedesiredclock edge (meeting tcks).Seefigurebelow.
A10
BANK SELECT
BA0, BA1
BANK ADDRESS
POWER-DOWN
CLK tCKS CKE tCKS
COMMAND
NOP Input buffers gated off
NOP
ACTIVE tRCD tRAS tRC DON'T CARE
All banks idle
Enter power-down mode
Exit power-down mode
less than 64ms
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POWER-DOWN MODE CYCLE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH A0-A9, A11, A12 ALL BANKS A10 SINGLE BANK tAS tAH BA0, BA1 BANK PRECHARGE tCK
T1 tCL
T2 tCH tCKS
Tn+1 tCKS
Tn+2
NOP
NOP
NOP
ACTIVE
ROW ROW
BANK
DQ High-Z Two clock cycles Precharge all active banks All banks idle, enter power-down mode Input buffers gated off while in power-down mode All banks idle
Exit power-down mode
DON'T CARE
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BURST READ/SINGLE WRITE
Theburstread/singlewritemodeisenteredbyprogramming the write burst mode bit (M9) in the mode register to a logic 1. In this mode, all WRITE commands result in the access ofasinglecolumnlocation(burstofone),regardlessof theprogrammedburstlength.READcommandsaccess columns according to the programmed burst length and sequence,justasinthenormalmodeofoperation(M9 =0). SDRAMssupportCONCURRENTAUTOPRECHARGE. FourcaseswhereCONCURRENTAUTOPRECHARGE occurs are defined below.
READ with Auto Precharge
1.InterruptedbyaREAD(withorwithoutautoprecharge): AREADtobankmwillinterruptaREADonbankn, CAS latency later.The PRECHARGE to bank n will beginwhentheREADtobankmisregistered. 2.InterruptedbyaWRITE(withorwithoutautoprecharge): AWRITEtobankmwillinterruptaREADonbankn whenregistered.DQMshouldbeusedthreeclocksprior totheWRITEcommandtopreventbuscontention.The PRECHARGEtobanknwillbeginwhentheWRITEto bank m is registered.
CONCURRENT AUTO PRECHARGE
Anaccesscommand(READorWRITE)toanotherbank while an access command with auto precharge enabled is executingisnotallowedbySDRAMs,unlesstheSDRAM supports CONCURRENT AUTO PRECHARGE. ISSI
READ With Auto Precharge interrupted by a READ
T0 CLK COMMAND BANK n NOP
READ - AP BANK n
T1
T2
T3
T4
T5
T6
T7
NOP
READ - AP BANK m
NOP
NOP
NOP
NOP
Page Active
READ with Burst of 4
Interrupt Burst, Precharge tRP - BANK n
Idle tRP - BANK m Precharge
Internal States
BANK m ADDRESS DQ CAS Latency - 3 (BANK n) Page Active
BANK n, COL a BANK n, COL b
READ with Burst of 4
DOUT a
DOUT a+1
DOUT b
DOUT b+1 DON'T CARE
CAS Latency - 3 (BANK m)
READ With Auto Precharge interrupted by a WRITE
T0 CLK COMMAND BANK n
READ - AP BANK n
T1
T2
T3
T4
T5
T6
T7
NOP
NOP
NOP
WRITE - AP BANK m
NOP
NOP
NOP Idle tDPL - BANK m Write-Back
READ with Burst of 4 Page Active Page Active
BANK n, COL a BANK m, COL b
Interrupt Burst, Precharge tRP - BANK n WRITE with Burst of 4
Internal States
BANK m ADDRESS DQM DQ
DOUT a CAS Latency - 3 (BANK n)
DIN b
DIN b+1
DIN b+2
DIN b+3 DON'T CARE
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
49
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
WRITE with Auto Precharge
3.InterruptedbyaREAD(withorwithoutautoprecharge): AREADtobankmwillinterruptaWRITEonbanknwhen registered, with the data-out appearing (CAS latency) later.ThePRECHARGEtobanknwillbeginaftertdpl is met, where tdplbeginswhentheREADtobankmis registered.ThelastvalidWRITE to bank n will be data-in registeredoneclockpriortotheREADtobankm. 4.InterruptedbyaWRITE(withorwithoutautoprecharge): AWRITE to bank m will interrupt a WRITE on bank n when registered.ThePRECHARGEtobanknwillbeginafter tdpl is met, where tdplbeginswhentheWRITEtobank misregistered.ThelastvaliddataWRITEtobankn willbedataregisteredoneclockpriortoaWRITEto bank m.
WRITE With Auto Precharge interrupted by a READ
T0 CLK T1 T2 T3 T4 T5 T6 T7
COMMAND
NOP
WRITE - AP BANK n
NOP
READ - AP BANK m
NOP
NOP
NOP
NOP
BANK n
Page Active
WRITE with Burst of 4
Interrupt Burst, Write-Back tDPL - BANK n
Precharge tRP - BANK n tRP - BANK m Precharge
Internal States
BANK m Page Active
BANK n, COL a BANK m, COL b
READ with Burst of 4
ADDRESS
DQ
DIN a
DIN a+1 CAS Latency - 3 (BANK m)
DOUT b
DOUT b+1 DON'T CARE
WRITE With Auto Precharge interrupted by a WRITE
T0 CLK T1 T2 T3 T4 T5 T6 T7
COMMAND
NOP
WRITE - AP BANK n
NOP
NOP
WRITE - AP BANK m
NOP
NOP
NOP
BANK n
Page Active
WRITE with Burst of 4
Interrupt Burst, Write-Back tDPL - BANK n
Precharge tRP - BANK n tDPL - BANK m Write-Back
Internal States
BANK m Page Active
BANK n, COL a BANK m, COL b
WRITE with Burst of 4
ADDRESS
DQ
DIN a
DIN a+1
DIN a+2
DIN b
DIN b+1
DIN b+2
DIN b+3 DON'T CARE
50
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
SINGLE READ WITH AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS A0-A9, A11, A12 A10 BA0, BA1 DQ tAH ROW tAS tAH ROW tAS tAH BANK
ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
NOP
NOP
READ
NOP
NOP
ACTIVE
NOP
tCMS tCMH
COLUMN m(2) ENABLE AUTO PRECHARGE
ROW ROW
BANK tAC tOH DOUT m tRCD tRAS tRC CAS Latency tRP tHZ
BANK
DON'T CARE UNDEFINED
Notes: 1) CAS latency = 2, Burst Length = 1 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
51
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
SINGLE READ WITHOUT AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 DQ ROW tAS tAH ROW tAS tAH BANK ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
READ tCMS tCMH
NOP
NOP
PRECHARGE
NOP
ACTIVE
NOP
COLUMN m(2) ALL BANKS
ROW ROW
DISABLE AUTO PRECHARGE BANK tAC tLZ CAS Latency tOH DOUT m tRCD tRAS tRC tHZ
SINGLE BANK BANK BANK
DON'T CARE tRP UNDEFINED
Notes: 1) CAS latency = 2, Burst Length = 1 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
52
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
READ WITH AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 DQ ROW tAS tAH ROW tAS tAH BANK ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
READ tCMS tCMH
NOP
NOP
NOP
NOP
NOP
ACTIVE
COLUMN m(2) ENABLE AUTO PRECHARGE
ROW ROW
BANK tAC tLZ CAS Latency tAC DOUT m tOH tAC DOUT m+1 tOH tAC DOUT m+2 tOH tRP tHZ DOUT m+3 tOH
BANK
tRCD tRAS tRC
DON'T CARE UNDEFINED
Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
53
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
READ WITHOUT AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 DQ ROW tAS tAH ROW tAS tAH BANK ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
READ tCMS tCMH
NOP
NOP
NOP
PRECHARGE
NOP
ACTIVE
COLUMN m(2) ALL BANKS
ROW ROW
DISABLE AUTO PRECHARGE BANK tAC tLZ CAS Latency tAC DOUT m tOH tAC DOUT m+1 tOH
SINGLE BANK BANK tAC DOUT m+2 tOH tRP tHZ DOUT m+3 tOH DON'T CARE UNDEFINED BANK
tRCD tRAS tRC
Notes: 1) CAS latency = 2, Burst Length = 4 2) x16: A9, A11, A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
54
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
SINGLE WRITE WITH AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML, DQMH A0-A9, A11, A12 A10 BA0, BA1 tAS tAH ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
T9
NOP
NOP
NOP
WRITE tCMS tCMH
NOP
NOP
NOP
ACTIVE
NOP
ROW tAS tAH ROW tAS tAH BANK
COLUMN m(2) ENABLE AUTO PRECHARGE
ROW ROW
BANK tDS tDH
BANK
DQ tRCD tRAS tRC
DIN m tDPL tRP DON'T CARE
Notes: 1) Burst Length = 1 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
55
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
SINGLE WRITE - WITHOUT AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 ROW tAS tAH ROW tAS tAH BANK ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
WRITE tCMS tCMH
NOP
NOP
PRECHARGE
NOP
ACTIVE
NOP
COLUMN m(2)
DISABLE AUTO PRECHARGE
ROW
ALL BANKS
ROW
SINGLE BANK
BANK tDS tDH
BANK
BANK
DQ tRCD tRAS tRC
DIN m tDPL(3) tRP DON'T CARE
Notes: 1) Burst Length = 1 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" 3) tras must not be violated.
56
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
WRITE - WITH AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 ROW tAS tAH ROW tAS tAH BANK ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
T9
NOP
WRITE tCMS tCMH
NOP
NOP
NOP
NOP
NOP
NOP
ACTIVE
COLUMN m(2) ENABLE AUTO PRECHARGE
ROW ROW
BANK tDS tDH tDS tDH DIN m+1 tDS tDH DIN m+2 tDS tDH
BANK
DQ tRCD tRAS tRC
DIN m
DIN m+3 tDPL tRP
DON'T CARE
Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care"
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
57
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
WRITE - WITHOUT AUTO PRECHARGE
T0 CLK tCKS tCKH CKE tCMS tCMH COMMAND DQM/DQML DQMH tAS tAH A0-A9, A11, A12 A10 BA0, BA1 ROW tAS tAH ROW tAS tAH BANK ACTIVE
tCK
T1
tCL
T2
tCH
T3
T4
T5
T6
T7
T8
NOP
WRITE tCMS tCMH
NOP
NOP
NOP
PRECHARGE
NOP
ACTIVE
COLUMN m(2) ALL BANKS
ROW ROW
DISABLE AUTO PRECHARGE BANK tDS tDH tDS tDH DIN m+1 tDS tDH DIN m+2 tDS tDH
SINGLE BANK BANK BANK
DQ tRCD tRAS tRC
DIN m
DIN m+3 tDPL(3) tRP
DON'T CARE
Notes: 1) Burst Length = 4 2) x16: A9, A11, and A12 = "Don't Care" x8: A11 and A12 = "Don't Care" 3) tras must not be violated.
58
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
ORDERING INFORMATION - VDD = 3.3V Commercial Range: 0C to +70C
Frequency 166MHz 143MHz 133MHz Frequency 166MHz 143MHz 133MHz 166MHz 143MHz 133MHz Speed (ns) 6 7 7.5 Speed (ns) 6 7 7.5 6 7 7.5 Order Part No. IS42S83200D-6TL IS42S83200D-7TL IS42S83200D-75ETL Order Part No. IS42S16160D-6TL IS42S16160D-6T IS42S16160D-7TL IS42S16160D-7T IS42S16160D-75ETL IS42S16160D-6BL IS42S16160D-6B IS42S16160D-7BL IS42S16160D-7B IS42S16160D-75EBL Package 54-PinTSOPII,Lead-free 54-PinTSOPII,Lead-free 54-PinTSOPII,Lead-free Package 54-PinTSOPII,Lead-free 54-PinTSOPII 54-PinTSOPII,Lead-free 54-PinTSOPII 54-PinTSOPII,Lead-free 54-BallBGA,Lead-free 54-BallBGA 54-BallBGA,Lead-free 54-BallBGA 54-BallBGA,Lead-free


Industrial Range: -40C to +85C
Frequency 166MHz 143MHz 133MHz Speed (ns) 6 7 7.5 Order Part No. IS42S83200D-6TLI IS42S83200D-7TLI IS42S83200D-75ETLI Package 54-PinTSOPII,Lead-free 54-PinTSOPII,Lead-free 54-PinTSOPII,Lead-free
Frequency Speed (ns) Order Part No. Package 166MHz 6 IS42S16160D-6TLI 54-PinTSOPII,Lead-free IS42S16160D-6TI 54-PinTSOPII 143MHz 7 IS42S16160D-7TLI 54-PinTSOPII,Lead-free IS42S16160D-7TI 54-PinTSOPII 133MHz 7.5 IS42S16160D-75ETLI 54-PinTSOPII,Lead-free 166MHz 6 IS42S16160D-6BLI 54-BallBGA,Lead-free IS42S16160D-6BI 54-BallBGA 143MHz 7 IS42S16160D-7BLI 54-BallBGA,Lead-free IS42S16160D-7BI 54-BallBGA 133MHz 7.5 IS42S16160D-75EBLI 54-BallBGA,Lead-free PleasecontactProductManagerforLeadedpartssupport.


Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
59
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
Automotive Range A1: -40C to +85C
Frequency 166MHz 143MHz Frequency 166MHz 143MHz 133MHz Speed (ns) 6 7 Speed (ns) 6 7 7.5 Order Part No. IS45S83200D-6TLA1 IS45S83200D-7TLA1 IS45S83200D-7CTNA1 Order Part No. IS45S16160D-6TLA1 IS45S16160D-6BLA1 IS45S16160D-7TLA1 IS45S16160D-7CTNA1 IS45S16160D-7BLA1 IS45S16160D-75ETLA1 IS45S16160D-75EBLA1 Package 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn 54-PinTSOPII,CuleadframeplatedwithNiPdAu Package 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn 54-ballBGA,SnAgCuballs 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn 54-PinTSOPII,CuleadframeplatedwithNiPdAu 54-ballBGA,SnAgCuballs 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn 54-ballBGA,SnAgCuballs
Automotive Range A2: -40C to +105C
Frequency 143MHz Frequency 143MHz Speed (ns) 7 Speed (ns) 7 Order Part No. IS45S83200D-7TLA2 IS45S83200D-7CTNA2 Order Part No. IS45S16160D-7TLA2 IS45S16160D-7CTNA2 IS45S16160D-7BLA2 Package 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn 54-PinTSOPII,CuleadframeplatedwithNiPdAu Package 54-PinTSOPII,Alloy42leadframeplatedwithmatteSn 54-PinTSOPII,CuleadframeplatedwithNiPdAu 54-ballBGA,SnAgCuballs
Notes: 1.ContactProductMarketingforleadedpartssupport. 2.Partnumberswith"L"or"N"areleadfree,andRoHScompliant.
60
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
61
NOTE :
1. Controlling dimension : mm
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
2. Dimension D and E1 do not include mold protrusion .
3. Dimension b does not include dambar protrusion/intrusion.
(For NiPdAu LF) 54LTSOP-2
Package Outline
09/15/2008
62
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
IS42S83200D, IS42S16160D IS45S83200D, IS45S16160D
1. CONTROLLING DIMENSION : MM . 2. Reference document : JEDEC MS-207
NOTE :
Integrated Silicon Solution, Inc. -- www.issi.com
Rev. B 06/11/09
Package Outline
08/29/2008
63


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